At IFA 2019 happening in Germany, the CEO of Huawei, Richard Yu unveiled Huawei's latest flagship Kirin 990 series. It consists of the Kirin 990 (5G) which is the world's first 5G SoC which will enable end users to access superb 5G connectivity and experiences.
It features the industry's most compact 5G smartphone solution with the processor integrated with a 5G modem using Huawei's cutting edge 7 nm+ EUV manufacturing process. Not only does the chip support non-standalone (NSA) and standalone (SA) architectures but by achieving a smaller area, the processor allows for a lower power consumption. The new chip is based on the Balong 5000's excellent 5G connectivity capabilities, with a leading peak downlink rate of 2.3Gbit/s and an uplink rate of 1.25Gbit/s.
Inside, the processor also comprises of a dual-core NPU based on the Da Vinci architecture. There are two large and four tiny NPU cores. In combination, the large cores help with heavy computing scenarios while the tiny core structure is an industry first and helps with ultra-low power consumption applications. Similarly, the processor's CPU is also made of two ultra-large cores, two large cores and four small cores with a dominant frequency of 2.86GHz. It also uses a 16-core Mali-G76 GPU.
As for photography, the Kirin 990 (5G) sports a brand-new ISP 5.0 that pioneers block-matching and 3D filtering professional-level hardware noise reduction (NR). With this, users will be able to capture brighter and sharper images in low light environments. Furthermore, it is the first to use dual-domain video NR for more accurate noise processing for videos. Expect to see more about the processor with the launch of Huawei's new flagship Mate 30 series in two weeks' time.